Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...

What design considerations are there for 3D IC packaging? How do issues like thermal design differ with 3D IC packages? 3D IC ...

Packing more IC functionality into smaller form factors stacks the deck against IC makers and foreshadows difficult interconnect challenges. How much can one package take? As consumer electronics ...

The relentless pursuit of performance in sectors such as AI, cloud computing, and autonomous driving is creating a heat crisis. As the next generation of processors demand more power in smaller spaces ...

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...

Siemens Digital Industries Software is adopting a new approach for sharing accurate thermal models of IC packages to the electronics supply chain. The main advantages are protecting IP, enhancing ...

The shift toward more complex IC packages requires more advanced inspection systems in the production flow to capture unwanted defects in products. This includes traditional optical inspection tools ...

Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

The modern world runs on integrated circuits (ICs). From smartphones and cars to AI data centers, medical equipment, ...

DUBLIN--(BUSINESS WIRE)--Research and Markets has announced the addition of the "Advanced IC Packaging Technologies, Materials and Markets, 2016 Edition" report to their offering. The demand for ...